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MediaTek Launches Dimensity 7050 Chipset for Enhanced Performance

Discover the latest tech innovation as MediaTek unveils the power-efficient Dimensity 7050 chipset, designed to optimize gaming sessions and deliver extended battery life. Learn about its advanced features, including MediaTek HyperEngine gaming enhancements, advanced camera technologies, and MiraVision 4K HDR video processing for an immersive experience. Explore the capabilities of this newly launched chipset and its impact on the upcoming Lava Agni 2 5G smartphone.

MediaTek has introduced its highly anticipated Dimensity 7050 chipset, which is set to power the upcoming Lava Agni 2 5G smartphone. This collaboration between MediaTek and Lava marks a significant milestone, with Lava becoming the first original equipment manufacturer (OEM) in the country to incorporate the newly launched chipset into their devices.

The Dimensity 7050 chipset boasts power efficiency and is based on the 6nm class, delivering advanced 5G integration. Equipped with MediaTek 5G UltraSave, the chipset ensures exceptional performance and prolonged battery life. Smartphone manufacturers can leverage the Dimensity 7050 to create sleek and visually appealing 5G devices, offering improved CPU performance, low power consumption, and a seamless gaming experience.

MediaTek Dimensity 7050
ProcessTSMC 6nm
CPU, big cores2 x Cortex-A78 @ 2.6GHz
CPU, small cores6 x Cortex-A55 @ 2.0GHz
GPUMali-G68 MC4
StorageUFS 3.1
Display1080p+, 120Hz
5GDual SIM
Local wirelessWi-Fi 6, Bluetooth 5.2

Key Features of the MediaTek Dimensity 7050 Chipset

  • MediaTek HyperEngine: Designed to provide gamers with intelligent speed and power-saving capabilities, this chipset features built-in 5G HSR mode that actively seeks out and connects to the cell tower with the lowest delay, ensuring a lag-free gaming experience.
  • Fast Speeds: The Arm Mali-G68 graphics engine and octa-core CPU with two Arm Cortex-A78 processors, clocked up to 2.6GHz, deliver superior performance, rapid app response, and smooth gaming while optimizing battery life.
  • Support for 200MP Photos and 4K HDR Video: With support for 200MP main cameras and advanced hardware-based camera engines, the Dimensity 7050 chipset enables users to capture larger, brighter, and sharper photos. The chipset also incorporates premium noise reduction techniques, enhancing overall image quality. Additionally, it facilitates the seamless recording of 4K HDR video.
  • AI for Next-Generation Cameras: The specialized, multi-core AI processing unit empowers single cameras to perform impressive tricks, such as soft background (AI-bokeh) and selective focus, ideal for selfie vlogs and live streams.
  • Wi-Fi 6 and Enhanced Connectivity: Equipped with 2×2 MIMO Wi-Fi 6 technology, the chipset enables faster and more reliable internet connectivity. With Bluetooth 5 and GNSS integrated into the chip, wireless connectivity consumes less power compared to separate chip solutions.
  • Fast and Efficient 5G Connectivity: The Dimensity 7050 chipset leverages both low and mid-band frequencies, delivering faster and more efficient 5G connectivity for an enhanced user experience.

With the introduction of the Dimensity 7050 chipset, MediaTek continues to push the boundaries of technological innovation, offering superior performance, advanced camera capabilities, and seamless connectivity, ultimately enhancing the user experience in the upcoming Lava Agni 2 5G smartphone.